Extropic Signs $75M LOI to Onshore Thermodynamic Computing

Extropic has signed a $75 million letter of intent with the U.S. Department of Commerce. The agreement supports efforts to scale production of thermodynamic computing chips for AI workloads and fabricate them at an American foundry. The deal is framed as bringing the technology home, with founders and investors noting its patriotic emphasis and referring to it as a shift toward Series USA funding. Planned CHIPS R&D funding is cited as a mechanism to advance domestic manufacturing of Thermodynamic Sampling Units.