Posts Highlight Xiaomi AI Cube Chip Details
Social posts examine Xiaomi XRING 03 SoC and AI Cube device specs.
TLDR
Teortaxes posted that XRING 03 is a high-end Xiaomi SoC on 6nm with wafer-on-wafer NPU-DRAM bonding at 1.4µm pitch and expressed surprise that TSMC apparently fabricated it. Tunguz replied that a Xiaomi Cube belongs in every home. The two posts link to images and another account but supply no first-party Xiaomi announcement or product confirmation. Packet summaries mention a prototype with three custom chips, 200 TOPS NPU, and up to 160GB memory, yet those details remain unverified claims tied only to the social reactions.
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Teortaxes▶️ (DeepSeek 推特🐋铁粉 2023 – ∞)@teortaxesTexThis is extremely interesting. What's going on here? XRING 03 is trivial, high-end SoC from Xiaomi. What the hell is 0100 though? 6nm, Wafer-on-wafer NPU-DRAM bonding with 1.4µm pitch. Similar philosophy to Logic Folding. I'm surprised that TSMC (apparently) fabbed that.…
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BT Bojan Tunguz@tunguzA Xiaomi Cube in every home. https://twitter.com/itsmeajaykv/status/2091827310160908400
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ZE Zephyr@zephyr_z9"A0, no MTP, no spec decode, unoptimized software stack Still mogs Rubin" If someone told me this yesterday, that a chip like this exists, then I would have called them crazy
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