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Tom’s Hardware reports that Intel has a U.S. patent involving MicroLEDs embedded inside chip packaging using a glass substrate and through-glass vias.
Tom’s Hardware reports that Intel has a U.S. patent involving MicroLEDs embedded inside chip packaging using a glass substrate and through-glass vias.
TLDR
Tom’s Hardware reports that Intel has a U.S. patent involving MicroLEDs embedded inside chip packaging using a glass substrate and through-glass vias.
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